WebElectromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms.The effect is important in applications where high direct current densities are used, such as in microelectronics and related structures. As the structure size in … WebSpring 2004 Evolving Small Structures Z. Suo transmission electron microscope image of an interconnect structure. The structure is a three-dimensional network of conductor lines embedded in a dielectric matrix, fabricated on the silicon surface that contains the active devices. The conductor lines are on several levels, and linked by vias.
Copper On-Chip Interconnections - Electrochemical Society
WebJan 1, 2003 · Stress-induced voiding, hillock formation, electromigration, cracking, and de-bonding are some of the prominent reliability concerns for interconnect structures [1]. … WebFigure 40 In the copper interconnect structure, vias are also made of copper, and are susceptible to stress-induced voiding. - "Reliabilityof Interconnect Structures" the lou menu
Reliability test results of the interconnect structures of the front ...
WebIn this paper, we build several 3D models of a simple circuit with different interconnect structures and examine the effect of the layout structural changes, such as the via and … WebApr 13, 2024 · WishBone interconnect primarily focuses on design reuse to address integration problems by establishing a general-purpose interface between IP cores. This helps in improving the system’s portability and reliability. This interconnect comprises two interfaces which are master and slave. The IPs are master interfaces that can initiate bus … WebApr 26, 2006 · This paper will focus on reliability study of interconnect structure for two areas. The first area is reliability of interconnect structure in thermal cycling test. Major … tic.netxinvestor login